Engaged in the development of semiconductor manufacturing processes and process integration technologies, with particular expertise in wiring (Cu) process technologies. Developed and mass-produced Cu-Cu hybrid bonding technology, enabling high‑density semiconductor chip stacking for Sony’s stacked CMOS image sensors, for the first time in the world. Promoting the evolution of CuCu hybrid bonding and other chip stacking technologies to realize three-dimensional semiconductor devices such as CMOS image sensors, memories, CPUs/GPUs and AI-related semiconductors.

Prime Minister Award, The National Commendation for Invention (2024)
Awards for Science and Technology (Development Category), The Commendation for Science and Technology by the Minister of Education, Culture, Sports, Science and Technology (2026)