0.26-inch LED Microdisplay using Pixel Level Cu-Cu Connections of Transferred GaN/Si and CMOS Backplane Wafer

Abstract

We have developed an integration process for LED Microdisplaytoward AR application. This process consists of Cu-Cu hybridization to connect heterogeneous materials; a transferred GaN/Si wafer and a CMOS backplane wafer, followed by the fabrication of LED mesa and On Chip Lense(OCL). We report the key features and results of this process and present a prototype of 0.26-inch 5644 ppi LED Microdisplay.

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