Examination of Panel-Level Manufacturing Methods for Glass Core Substrates

Abstract

The increasing size of package substrates presents various challenges, for which glass core substrates are considered a potential solution. The conventional process (CP) for manufacturing glass core substrates, while maintaining large glass panels, is straightforward but requires significant investment for double-sided interconnect formation and extensive equipment modifications to handle the glass without breakage. Recognizing CP as a promising method, we propose the Singulated Glass core Embedding Process (SGEP) as an alternative. SGEP addresses the challenges of CP by embedding singulated glass cores into glass-epoxy panels and processing them in this state. SGEP offers advantages such as glass edge protection and device embedding within the same process. However, it also has limitations, including lower theoretical yield and less stringent design rules compared to CP. This study examines the advantages and disadvantages of CP and SGEP, and highlights the technical challenges and improvements of SGEP. The results indicate that SGEP could be a feasible alternative, potentially expanding the options for panel-level manufacturing methods of glass core substrates.

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