Pixel-Parallel Image Sensor Architectures with 3D-Stacking Technology

Abstract

This talk introduces the pixel-parallel image sensor architectures that have rapidly evolved in recent years with the advent of 3D-stacking technology. Advances in the hybrid bonding process technology for image sensors as further shrinking the contact pitch with stable connections. This trend suggests the possibility of realizing complex pixel circuit architectures with practical pixel sizes and resolutions. The pixel-parallel configuration contributes not only to high-frame-rate and high-dynamic-range imaging, but also to the performance improvement of depth sensing, event-based vision sensing, and invisible light imaging with non-Si photo detectors. The next challenge will require more scalability, more optimization of process technologies, and more area efficiency to further evolve the imaging and sensing world.